Category: Glossary

Dispersion resulting from the different velocities of each wavelength in a material.

Highest recommended continuous use temperature based upon thermal endurance and historical data.

The difference between the solidus and liquidus temperature.

The ratio of the amount of open area in a mesh versus the amount of closed area in a mesh.

The number of openings per inch in a screen. For example, a 325 mesh screen has 325 openings per inch.

Boards built with a metallic core and an organic or inorganic insulation on either sides of the core. The core could be made of steel, stainless steel, aluminum, copper, or a laminate of metals (in most cases copper invar copper or copper tungsten copper). The insulation of the core is done prior to metallization.

(MegaHertz) One million Hertz (cycles per second).

See integrated systems digital network.

International Standards Organization.

Isotropic adhesives conduct electricity in all directions. This means the adhesive can be dispensed only on those areas (pads) where a circuit path is required (i.e., where bumps will attach).

A measure of the brittleness of a material. Brittle materials will have low izod impact values (.15 for example). Tough materials will have high izod impact strengths (.60 for example).

Measure of temperature where water freezes at 273° and boils at 373°.

One thousand.

A very strong, very light, synthetic compound developed by Du Pont which is used to strengthen optical cables.

(Kilogram) Approximately 2.2 pounds.

One thousand cycles per second.

(Kilometer) 1km = 3,280 feet or 0.62 miles.

A stack of prepregs with copper foils on either surface after lamination during PCB fabrication.

A heat and pressure cycle used to consolidate a stack of prepregs into a solid block. The term also refers to the consolidation of a stack of laminates (with circuitry) to form a PCB. Lamination is referred to as the C-stage in PCB fabrication.

See local area network.