Category: Glossary

Usually, a fiber with a core of 200 um or more.

Acronym for light amplification by stimulated emission of radiation. Lasers usually have low bandwidth and high power. Lasers in fiber optics are usually solid-state semiconductor types.

A semiconductor that emits coherent light when forward biased.

The process during which liquid solder dissolves a metal coating.

A wire that connects two points in a circuit; it is usually self-supporting.

A soft heavy gray metal used in solder and other alloys.

A sheet metal framework etched to form an array of metal traces (leads). An IC is attached to the lead frame at the innermost portion of the leads, and the outermost portion of the leads is attached to the next level of the assembly. However, lead frames are the basis for molded carrier ring (MCR) and plastic quad flatpack (PQFP) components, while TAB frames are the basis for TAB components.

A property of absorbing and holding moisture.

See Hertz.

Institute of Electrical and Electronic Engineers.

To fill the voids and spaces of an electrical unit with a compound. (This does not imply complete fill or complete coating of the surfaces by a hole-free film).

An electrical test of a PCB assembly in which each component is tested individually, even though many components are soldered to the PCB.

(Also refractive index) The ratio of the velocity of light in free space to the velocity of light in a fiber material. Symbolized by n. Always greater than or equal to one.

A fluid whose index of refraction nearly equals that of the fiber’s core. Used to reduce Fresnel reflection at fiber ends. See also index-matching gel.

A gel whose index of refraction nearly equals that of the fiber’s core. Used to reduce Fresnel reflection at fiber ends. See also index-matching fluid.

A gaseous atmosphere that is not conducive to chemical reactions, such as helium or nitrogen.

(IR) The invisible portion of the electromagnetic spectrum bounded by the long-wavelength extreme of the visible spectrum (about 0.7 um) and the shortest microwaves (about 1000 um). See also frequency, light.

(Indium gallium arsenide) Generally used to make high-performance long-wavelength detectors.

(Indium gallium arsenide phosphide) Generally used for long-wavelength light emitters.

Printed circuit boards made by molding filler-reinforced resins into a desired shape. Routing and through hole metallizations are performed by seeding and plating, or by printing. An alternative approach is to transfer mold the interconnect directly onto the injection molded cards.