Any device that absorbs and draws off heat from a hot object, thereby neutralizing the extreme temperature.
Hermetic
The sealing of an object so it is airtight.
Hertz
One cycle per second.
Humidity (Absolute)
The amount of moisture present in the atmosphere expressed in grams per cubic meter.
Humidity (Relative)
The ratio of the amount of moisture contained in the atmosphere to the amount of moisture that can be carried in the atmosphere at a given temperature. Relative humidity is expressed in percent, e.g., 75% R.H. at a given temperature means that the air is 75% saturated with moisture.
Hydrophilic Solvent
Refer to “polar solvent.”
Hydrophobic Solvent
Refer to “nonpolar solvent.”
Fisheye
Small globular mass which has not blended completely into the surrounding material and is particularly evident in a transparent or translucent material.
FIT
Rate Number of device failures in one billion device hours.
Flame Retardance
The ability of an epoxy system to resist combustion or burning. Some materials tend to extinguish themselves when subjected to a flame. Such materials are classified as self-extinguishing. ASTM D790-63.
Flash Point
The temperature at which the material gives off flammable vapor in sufficient quantity to ignite momentarily on the application of a flame under specified conditions.
Flex Circuits
Flexible printed circuit boards made using thin polyimide or polyester film with copper circuitry on one or both sides of the flex. Flex circuits can be single or multilayer.
Flexural Modulus
The ratio, within the elastic limit, of flexural stress to the corresponding strain. It is expressed in pounds per square inch. ASTM D790-63.
Flexural Strength
Ability of a material to withstand failure due to bending.
Flip Chip
Any packaging scheme in which the active circuitry of an IC is placed facing the surface of the substrate. Examples are flip TAB and C-4.
Flow
Movement of the epoxy during the curing stages before completely cured.
Foot Length
The part of the component lead that comes in contact with the bonding pad on the substrate.
Forced Drying Temperatures
A temperature between room temperature and 150°F.(65°C).
FOTP
See fiber optic test procedure.
Functional Test
The electrical testing of an entire assembly that simulates the intended function of the product.