Fiber Optic Test Procedure

(FOTP) Standards developed and published by the Electronic Industries Association (EIA) under the EIA-RS-455 series of standards.

FiberOptic

(variously “fiber optic,” “fibre optic” (England), and “fiberoptic,”) Refers to the conduction of light waves through materials of exceptional clarity and across long distances. FiberOptics demonstrate total internal reflection by combining like materials of differing indices of refraction.

Filler

A substance, often inert, added to a system to improve properties and/or decrease cost.

Filler Materials

Ceramic or metallic particles used to modify the properties of polymers.

Fine Pitch

Surface mount components with a lead pitch of at least 50 mils. Fine pitch is more commonly used to refer to components with a lead pitch of 25 mils or less. These packages usually require vision assistance for accurate placement.

Elastomer

A material which at room temperature can be stretched repeatedly to at least twice its original length and, upon immediate release of the stress, will return with force to its approximate original length.

Elastomeric

A material that at room temperature can be stretched repeatedly to at least twice its original length, and upon release of the stress, will return with force to its approximate original length. A rubber band is an example.

Electrode

A conductor through which a current enters or leaves an electrolytic cell, vacuum tube, or any nonmetallic conductor.

Electromagnetic Interference

(EMI) Any electrical or electromagnetic interference tha causes undesirable response, degradation, or failure in electronic equipment. Optical fibers neither emit nor receive EMI.

Electromagnetic Radiation [EMR)

Radiation made up of oscillating electric and magnetic fields and propagated with the speed of light. Includes gamma radiation, X-rays, ultraviolet, visible and infrared radiation, and radar and radio waves.

Electromigration

The electrolytic transfer of metal from one conductor to another conductor separated from the first conductor by a dielectric medium.

Electronic Packaging

The technology of interconnecting semiconductor and other electronic devices to provide an electronic function.

Electroplating

Deposition of metal onto a cathodic surface by passing DC current into an electrolytic solution.

EM

Abbreviation for electromagnetic.

EMI

Electromagnetic interference.