Category: Glossary

Centimeter. Approximately 0.4 inches.

Complementary metal oxide semiconductor. A family of IC’s. Particularly useful for low speed or low-power applications.

A thin layer of material, conductive or dielectric, applied over components or a base material.

Once cured, a measure of the change in length of an epoxy system over a given temperature range. It is expressed in inches per inch per degree C. ASTM D696-44.

Change in a unit of length or volume that accompanies a unit change in temperature.

The state in which the particles of a single substance are held together by primary or secondary valence forces observed in the tendency of the substance to stick to itself. As used in the adhesive field, the state in which the particles of the adhesive (or the adhered) are held together.

An individual functional element in a physically independent body (e.g., resistor, capacitor, or transistor).

Having a refractive index that differs for light of different polarizations.

The smallest unit of information upon which digital communications are based; also an electrical or optical pulse that carries this information.

An organic printed circuit card or board on which smaller components, cards, or modules can be mounted.

The union of materials by adhesives.

The unit load applied in tension, compression, flexure, peel, impact, cleavage, or shear, required to break an adhesive assembly with failure occurring in or near the plane of the bond. Note-The term adherence is frequently used in place of bond strength.

The joining of two materials. For instance, the attachment of a component to a substrate.

Copper traces, or pads, on a substrate to which leads are bonded. Dimensions and thermal path from the bonding pads must be properly designed to achieve uniform solder reflow.

An instrument for measuring the viscosity of formulated adhesives under standard conditions of temperature.

Internal void or a trapped globule of air or other gas.

A small mound formed on the device or the substrate pads that can be used as a contact for face-down bonding. This is a method of providing connections to the terminal areas of a device.

The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.

Measure of temperature where water freezes at 0° and boils at 100°.

The final stage in the reaction of certain thermosetting resins in which the material is relatively insoluble and infusible. Certain thermosetting resins in a fully cured state are in this stage.