Category: Glossary

The return of a portion of scattered light to the input end of a fiber; the scattering of light in the direction opposite to its original propagation.

A temperature above 150°F.(65.6°C). Refers to curing materials at these elevated temperatures.

A leadless surface-mountable package in which solder ball interconnects cover the bottom surface of the package in a checkboard fashion. BGAs are reflow soldered to PCBs using a mass reflow process.

The range of frequencies over which a particular instrument is designed to function within specified limits.

An unpopulated PCB.

The smallest radius an optical fiber or fiber cable can bend before increased attenuation or breakage occurs.

Loss Attenuation caused by high-order modes radiating from the outside of a fiber optic waveguide which occur when the fiber is bent around a small radius. See also macrobending, microbending.

Alternating current.

A synthetic resin made from acrylic acid or a derivative thereof. Acrylics possess the property of transparency, as well as offer flame resistance.

A mixture of rosin and small amounts of organic-halide activators or organic-acid activators.

A substance that enhances the ability of a flux to remove oxides and other contaminants from surfaces being joined.

Electronic components such as semiconductors, transistors, diodes, etc., that can operate on an applied electrical signal and change its basic characteristics (e.g., switching, amplification, rectification).

A device used to convert analog signals to digital signal.

A process in which the conductive, resistive, and insulating materials are successively plated to define traces, pads, and elements.

The state in which two surfaces are held together by means of interfacial forces.

A substance capable of holding materials together by surface attachment.

The adhesion of gases or liquid molecules to the surface of solids or liquids with which they are in contact.

A hard fragmented material used with an epoxy binder as a flooring or surfacing medium. Also coarse filler used as a core for epoxy tools.

The change in the properties of a material over time and under varying conditions of humidity, temperature, pressure, etc.

Holes specifically designed in TAB tape for registration of a TAB frame. These holes can be located virtually anywhere on the tape site, however, locations are standardized in many cases.