Category: Glossary

Glass made mostly of silicon dioxide, SiO2, used in conventional optical fibers.

(SM) Fiber A small-core optical fiber through which only one mode will propagate. The typical diameter is 8-9 microns

The distance a substance (e.g., an adhesive) moves after it has been applied and cured.

Surface-mount device.

Surface-mount technology.

The range of temperature in which a thermoplastic changes from a rigid to a soft state.

The metal powder content as a percentage of the mass of the wet solder paste.

A solution capable of dissolving a solute.

Similar to encapsulating, except that steps are taken to insure complete penetration of all the voids in the object before the resin polymerizes.

A preliminary phase of a process during which the product is heated at a predetermined rate from the ambient temperature to a desired elevated temperature.

Increasing the temperature of a material above the ambient temperature to reduce the thermal shock and influence the dwell time during subsequent elevated temperature processing.

Partially-cured fiber-reinforced resin fabric. Also referred to as the B-stage in the manufacturing of PCB.

A graphical representation of the time versus temperature of a continuous furnace or oven cycle.

(Picosecond ) One trillionth of a second.

A fluid that displays a decrease in viscosity with an increase in the shear rate.

A measure of the quality of a solder joint formed between a component lead and a bonding pad on a substrate. This parameter is typically determined by placing a hook under the shoulder of a lead and pulling up.

(Picowatt) One trillionth of a Watt.

A ceramic or a plastic chip carrier in which the leads project down and away from all four sides of a square package.

The combined process of emission, transmission, and absorption of thermal energy between bodies separated by an empty space.

An instrument, distinct from a photometer, to measure power (Watts) of electromagnetic radiation.