Category: Glossary

A terminal device that includes a detector and signal processing electronics. It functions as an optical-to-electrical converter.

Gradient The change in refractive index with distance from the axis of an optical fiber.

The continued conformance of a device or system to a specification over an extended period of time.

Contaminants left behind on the surface of the substrate or the PCB as a consequence of both preassembly and assembly operations.

An organic polymer which, when mixed with a curing agent, crosslinks to form a thermosetting plastic.

The property of a material to oppose the flow of current.

The ability of a material to resist passage of electrical current either through its bulk or on a surface. The unit of volume resistivity is the ohm-cm, of surface resistivity, the ohm.

The study of the change in the form and flow of matter, embracing elasticity, viscosity, and plasticity.

Printed circuit board.

A true test of the adhesion between the lead and the bonding pad after it has been soldered. This parameter is determined by peeling the component lead off the bonding pad using special fixturing on a pull tester.

A two-electrode, radiation-sensitive junction formed in a semiconductor material in which the reverse current varies with illumination. ItÕs a semiconductor device that converts light to electrical current. Photodiodes are used for the detection of optical power and for the conversion of optical power to electrical power.

The technology involving light and photons at all wavelengths between the far-infrared and the ultra-violet. Also called “Optoelectronics”.

Providing an electric current under the influence of light or similar radiation.

The assembly process in which components are selected and placed onto specific locations of the PCB.

The fine solid particle, usually inorganic, used in the preparation of colored products, and substantially insoluble in the vehicle. In contrast, a dye is soluble.

Small regular or irregular crater in a surface, usually with its width approximately of the same order of magnitude as its depth.

The center-to-center spacing between pads, rows of bumps, pins, etc.

A cleaning process that uses electrically excited gas molecules to remove surface contamination. Most commonly found in applications where extreme cleanliness is required, such as bonding pad preparation on the chip and substrate for wire bonding.

With respect to materials science, the deformation of a material resulting from it being stressed beyond its ability to return to its original shape.

An optical fiber having a plastic core and plastic cladding.