Category: Glossary

Uneven surface somewhat resembling an orange peel.

A printed circuit board made from organic material (epoxy, polyimide, etc.).

The gaseous emission or de-aeration from a PCB or solder joint.

One trillionth.

The quantity of components, interconnections, and mechanical devices per unit volume.

The various members that comprise the packaging hierarchy, such as chip, chip carrier, PCB, system, etc.

A portion of the conductive pattern that is typically used for the connection, and/or attachment of components.

Generic name for a BGA component constructed on organic substrate material, such as FR-4, overmolded with plastic.

One millionth of a meter. Abbreviated um.

One millionth of a meter, and another term for micrometer. An easy conversion scheme is to remember that 25.4 microns=0.0254mm=0.001″=1 mil=1,000 microinches. With this formula memorized, it is simple to translate between inch and metric references.

One millionth of a second. Abbreviated us.

One millionth of a Watt. Abbreviated uW

Military specification.

Military standard.

One thousandth of an Amp.

Misregistration of the centerline of the component lead with respect to the centerline of the bonding pad on the substrate.

Abbreviation for multimode.

Any ingredient added to an epoxy formulation that changes its properties.

Having some resistance to high humidity. A moisture resistant adhesive will not be easily affected by moisture. Will not easily change its chemical and physical properties due to moisture. Should not be confused with “water proof.”

Plastic debris remaining on a plastic molded package after the component manufacturing process. This can occur on molded carrier ring (MCR) and plastic quad pack (PQFP) components.